BEOL Module Integration Engineer

About Samsung Austin Semiconductor

Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At SAS, we are Innovating Today to Power the Devices of Tomorrow. Come innovate with us!

Position Summary

As a Back-end of Line (BEOL) Module Integration Engineer, you will be responsible for Metal1 thru Fab-out steps’ process integration for all Tech Nodes produced at Samsung Austin Semiconductor (SAS). In this role within the Yield Enhancement organization, you will own all module related aspects of these steps – Primary focus will be deriving solutions for Technology Systematics, driving module process enhancements to improve yield, quality and cost competitiveness of products produced at SAS.

Role and Responsibilities

Specific Job Duties:

• Own Module Integration for specific group of steps within the Process flow.
• Own all Systematic Defect and Device/Parametric Yield related issues for these steps.
• Lead projects to cure these systematics from the technology and/or improve detection for them.
• Own critical dimension targeting and variation control within the Module.
• Review Yield, Cost, Throughput related Process changes across the factory at Change Control Board.
• Provide Yield risk assessment and failure modeling for factory incidents at Material Review Board.

Skills and Qualifications

Education, Training, Certification(s) and Minimum # Years Required:

• At least a Bachelor’s Degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related field is required.
• 3+ years of experience in BEOL Process/Module Integration in semiconductor manufacturing is required.
• 10+ years and/or FINFET experience highly preferred.
• Must have expert understanding of overall process flow in assigned areas – Demonstrated understanding of the interactions between process and yield, product performance and reliability.
• Prior knowledge in fab unit processes (including Lithography, Etch, Diffusion, Thin Films Deposition, Wet Cleans, CMP, etc.) highly preferred.

Knowledge, Skills, Abilities, Software, Tools:

• Expertise in Project Management, DOE generation and analyses.
• Expertise in Data analyses software (ex: JMP/Spotfire, etc.)
• Expertise in Excel, PowerPoint.
• Programming and/or scripting experience is a plus.
• Must have excellent communication, documentation and presentation skills.
• Ability to make and present Exec summaries required.
• Prior experience leading Cross Functional Task Force Teams (TFT) highly preferred.
• Demonstrated ability to meet deadlines and commitments while having the capability of shifting focus and changing priorities – dealing with ambiguity.
• Must have interpersonal skills to escalate issues, get support, and effect lasting change.
• Must have proven skills of peer leadership, and mentoring of junior engineers.

Salary Information

The current base salary range for this role is between $126,210 – $212,650. Individual base pay rates will depend on factors including…